August 23, 2015 | The provider of chip design technologies Ceva announced that it signed an agreement with chip company NXP for the production of Internet of Things technologies. According to the agreement, Ceva’s Bluetooth technology will be included in NXP’s chip series designed for wearable technologies. Ceva’s technology supports the entire range of Bluetooth standards and saves energy, with the goal of increasing the battery life of wearable technology. Ceva is based in Herzliya and was founded in 2002.
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